Temperature Range and Measurement Standards for Components and Module
standard by JEDEC Solid State Technology Association, 03/01/2022

CLSI, HEI, ICC, IPC, NACE, NBBI, TAPPI
ICC
Temperature Range and Measurement Standards for Components and Module
standard by JEDEC Solid State Technology Association, 03/01/2022
DDR5 Load Reduced (LRDIMM) and Registered Dual Inline Memory Module (RDIMM) Common Specification
standard by JEDEC Solid State Technology Association, 01/01/2022
Method for Developing Acceleration Models for Electronic Device Failure Mechanisms
standard by JEDEC Solid State Technology Association, 03/01/2022
Guideline to Specify a Transient Off-State Withstand Voltage Robustness Indicator in Datasheets for Lateral GaN Power Conversion Devices, Version 1.0
standard by JEDEC Solid State Technology Association, 12/01/2021
TS5111, TS5110 Serial Bus Thermal Sensor Device Standard
standard by JEDEC Solid State Technology Association, 01/01/2022
Serial Interface for Data Converters
standard by JEDEC Solid State Technology Association, 12/01/2021
Low Power Double Data Rate 5/5X (LPDDR5/LPDDR5X)
standard by JEDEC Solid State Technology Association, 06/01/2021
JEDEC Module Sideband Bus (SidebandBus)
standard by JEDEC Solid State Technology Association, 12/01/2021
SOLID STATE RELIABILITY ASSESSMENT QUALIFICATION METHODOLOGIES
standard by JEDEC Solid State Technology Association, 01/01/2019