Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
standard by Association Connecting Electronics Industries, 04/01/2022

Terms and Definitions for the Design and Manufacture of Printed Electronics
standard by Association Connecting Electronics Industries, 04/01/2022

Rail Transit Addendum to IPC-A-610G Acceptability of Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 03/01/2022

Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies
standard by Association Connecting Electronics Industries, 04/01/2022

Stencil and Misprinted Board Cleaning Handbook
standard by Association Connecting Electronics Industries, 03/01/2022

The Global Standard for Machine-to-Machine Communication in SMT Assembly Version 1.4
standard by Association Connecting Electronics Industries, 02/01/2022

Guidelines for Acoustic Emission Measurement Method During Mechanical Testing
standard by Association Connecting Electronics Industries, 08/01/2021

Requirements for Soldering Fluxes
standard by Association Connecting Electronics Industries, 01/01/2022

Troubleshooting for Printed Board Fabrication Processes
standard by Association Connecting Electronics Industries, 02/01/2022