Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
standard by Association Connecting Electronics Industries, 07/27/2021

CLSI, HEI, ICC, IPC, NACE, NBBI, TAPPI
IPC
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
standard by Association Connecting Electronics Industries, 07/27/2021
DFX Guidelines
standard by Association Connecting Electronics Industries, 08/01/2021
Trusted Electronic Designer, Fabricator and Assembler Requirements
standard by Association Connecting Electronics Industries, 08/01/2021
Handbook and Guide to IPC-D-620 and IPC/WHMA-A-620
Handbook / Manual / Guide by Association Connecting Electronics Industries, 04/01/2018
Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2021
Requirements for Soldered Electrical and Electronic Assemblies
Amendment by Association Connecting Electronics Industries,
Qualification and Performance Specification for Printed Electronics on Flexible Substrates
standard by Association Connecting Electronics Industries, 03/08/2021
Requirements for Electrical Testing of Flexible Printed Electronics
standard by Association Connecting Electronics Industries, 02/01/2021
Handbook and Guide to Supplement J-STD-001
Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/2021