In-Process DPMO and Estimated Yield for PWAs
standard by Association Connecting Electronics Industries, 03/01/2002
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CLSI, HEI, ICC, IPC, NACE, NBBI, TAPPI
IPC
In-Process DPMO and Estimated Yield for PWAs
standard by Association Connecting Electronics Industries, 03/01/2002
Design and Assembly Process Implementation for BGAs
standard by Association Connecting Electronics Industries, 07/01/2018
Book by Association Connecting Electronics Industries, 11/01/2000
Cleaning and Cleanliness Testing Program for: Phase – Low Solids Fluxes and Pastes Processed in Ambient Air
standard by Association Connecting Electronics Industries, 11/01/1994
Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies
standard by Association Connecting Electronics Industries, 01/01/1997
2nd International Conference on Optoelectronics: At The Speed of Light Proceedings (Kit – Hard Copy & CD)
Conference Proceeding by Association Connecting Electronics Industries, 07/01/2002
The 8th World Convention
Conference Proceeding by Association Connecting Electronics Industries,
IPC 7912/9261 End Item and In-Process DPMO Set
standard by Association Connecting Electronics Industries, 03/01/2002
Ten-Layer Multi Artwork – Kit
standard by Association Connecting Electronics Industries,