Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
standard by Association Connecting Electronics Industries, 05/01/1998
Category: IPC
IPC
IPC 2226
Sectional Design Standard for High Density Interconnect (HDI) Boards
standard by Association Connecting Electronics Industries, 05/01/2003
IPC 2226A
Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2017
IPC 2251
Design Guide for the Packaging of High Speed Electronic Circuits
Handbook / Manual / Guide by Association Connecting Electronics Industries, 11/01/2003
IPC 2252
Design Guide for RF/Microwave Circuit Boards
Handbook / Manual / Guide by Association Connecting Electronics Industries, 06/01/2002
IPC 2291
Design Guideline for Printed Electronics
standard by Association Connecting Electronics Industries, 06/01/2013
IPC 2292
Design Standard for Printed Electronics on Flexible Substrates
standard by Association Connecting Electronics Industries, 03/01/2018
IPC 2315
Design Guide for High Density Interconnects & Microvias
Handbook / Manual / Guide by Association Connecting Electronics Industries, 06/01/2000
IPC 2316
Design Guide for Embedded Passive Device Printed Boards
Handbook / Manual / Guide by Association Connecting Electronics Industries, 03/01/2007