Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
standard by Association Connecting Electronics Industries, 05/01/1998

CLSI, HEI, ICC, IPC, NACE, NBBI, TAPPI
IPC
Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
standard by Association Connecting Electronics Industries, 05/01/1998
Sectional Design Standard for High Density Interconnect (HDI) Boards
standard by Association Connecting Electronics Industries, 05/01/2003
Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2017
Design Guide for the Packaging of High Speed Electronic Circuits
Handbook / Manual / Guide by Association Connecting Electronics Industries, 11/01/2003
Design Guide for RF/Microwave Circuit Boards
Handbook / Manual / Guide by Association Connecting Electronics Industries, 06/01/2002
Design Guideline for Printed Electronics
standard by Association Connecting Electronics Industries, 06/01/2013
Design Standard for Printed Electronics on Flexible Substrates
standard by Association Connecting Electronics Industries, 03/01/2018
Design Guide for High Density Interconnects & Microvias
Handbook / Manual / Guide by Association Connecting Electronics Industries, 06/01/2000
Design Guide for Embedded Passive Device Printed Boards
Handbook / Manual / Guide by Association Connecting Electronics Industries, 03/01/2007