Specification for Base Materials for High Speed/High Frequency Applications
standard by Association Connecting Electronics Industries, 12/01/2011

Specification for Base Materials for High Speed/High Frequency Applications with Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2014

Specifications for High Density Interconnect (HDI) and Microvia Materials
standard by Association Connecting Electronics Industries, 05/01/1999

Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards
standard by Association Connecting Electronics Industries, 08/01/1998

Specification and Characterization Methods for Nonwoven "E" Glass Materials
standard by Association Connecting Electronics Industries, 09/01/1998

Flexible Base Dielectrics for Use in Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 05/01/2002

Flexible Base Dielectrics for Use in Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 04/01/2010

Flexible Base Dielectrics for Use in Flexible Printed Boards
standard by Association Connecting Electronics Industries, 12/01/2016

Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
standard by Association Connecting Electronics Industries, 05/01/2002