Cover and Bonding Material for Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 01/01/2013
Category: IPC
IPC
IPC 4204
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 05/01/2002
IPC 4204A
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 05/31/2012
IPC 4204A with Amendment 1
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 10/01/2013
IPC 4204B
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2018
IPC 4411
Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement
standard by Association Connecting Electronics Industries, 04/01/1999
IPC 4411-AM1
Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement, Amendment 1
Amendment by Association Connecting Electronics Industries, 03/01/2001
IPC 4411-K
Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement, with Amendment 1
standard by Association Connecting Electronics Industries, 03/01/2001
IPC 4411A
Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement
standard by Association Connecting Electronics Industries, 11/01/2003