Assembly Process Component Simulations, Guidelines and Classifications Package
standard by Association Connecting Electronics Industries, 03/01/2003
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CLSI, HEI, ICC, IPC, NACE, NBBI, TAPPI
IPC
Assembly Process Component Simulations, Guidelines and Classifications Package
standard by Association Connecting Electronics Industries, 03/01/2003
Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
standard by Association Connecting Electronics Industries, 12/01/2022
Standard Pitch Stencil Pattern for Slump Evaluation (Electronic Gerber Files)
standard by Association Connecting Electronics Industries,
Conflict Minerals Data Exchange Standard
standard by Association Connecting Electronics Industries, 03/01/2014
Book by Association Connecting Electronics Industries, 05/01/2004
Surface Mount Solder Joint Evaluation – Desk Reference Manual
Handbook / Manual / Guide by Association Connecting Electronics Industries, 12/01/2017
Bulk Feeding Summit Meeting Proceedings on CD Rom – September 1999
Conference Proceeding by Association Connecting Electronics Industries, 09/01/1999
Solderability Tests for Printed Boards
standard by Association Connecting Electronics Industries, 04/01/1992
Generic Guideline for Land Pattern Design
standard by Association Connecting Electronics Industries, 05/01/2023