Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards
standard by Association Connecting Electronics Industries, 05/01/1999

CLSI, HEI, ICC, IPC, NACE, NBBI, TAPPI
IPC
Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards
standard by Association Connecting Electronics Industries, 05/01/1999
Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
standard by Association Connecting Electronics Industries, 03/01/2009
Microwave End Product Board Inspection and Test
standard by Association Connecting Electronics Industries, 01/01/2002
Microwave End Product Board Inspection and Test
standard by Association Connecting Electronics Industries, 11/01/2011
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
standard by Association Connecting Electronics Industries, 07/01/2016
Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Amendment by Association Connecting Electronics Industries, 07/01/2016
Performance guide Manual for single- and double-sided flexible printed wiring boards
standard by Association Connecting Electronics Industries, 10/01/1999
Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards
standard by Association Connecting Electronics Industries, 01/01/2000
Application Categories for Printed Electronics
standard by Association Connecting Electronics Industries, 07/01/2015