Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)
Handbook / Manual / Guide by Association Connecting Electronics Industries, 10/01/2015

CLSI, HEI, ICC, IPC, NACE, NBBI, TAPPI
IPC
Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)
Handbook / Manual / Guide by Association Connecting Electronics Industries, 10/01/2015
Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)
standard by Association Connecting Electronics Industries, 01/01/2018
Design and Assembly Process Implementation of 3D Components
standard by Association Connecting Electronics Industries, 06/01/2017
Design and Assembly Process Implementation for Embedded Components
standard by Association Connecting Electronics Industries, 02/01/2015
Design and Assembly Process Implementation for Bottom Termination Components
standard by Association Connecting Electronics Industries, 03/28/2011
Design and Assembly Process Implementation for Flip Chip and Die Size Components
standard by Association Connecting Electronics Industries, 02/01/2009
Design and Assembly Process Implementation for Flip Chip and Die-Size Components
standard by Association Connecting Electronics Industries, 01/01/2018
Design and Assembly Process Implementation for BGAs
standard by Association Connecting Electronics Industries, 01/01/2005
Design and Assembly Process Implementation for BGAs
standard by Association Connecting Electronics Industries, 03/01/2008