In-Process DPMO and Estimated Yield for PCAs
standard by Association Connecting Electronics Industries, 10/01/2006

Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability
standard by Association Connecting Electronics Industries, 12/01/2018

PWB Assembly Process Simulation for Evaluation of Electronic Components
standard by Association Connecting Electronics Industries, 07/10/1995

PWB Assembly Soldering Process Guideline for Electronic Components
standard by Association Connecting Electronics Industries, 04/01/1999

Moisture Sensitivity Classification for Non-IC Components
standard by Association Connecting Electronics Industries, 04/01/1999

Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
standard by Association Connecting Electronics Industries, 06/01/1998

Guideline Methodology for Assessing Component and Cleaning Materials Compatibility
standard by Association Connecting Electronics Industries, 09/27/2017

Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices
standard by Association Connecting Electronics Industries, 04/01/2006

Requirements for Power Conversion Devices for the Computer and Telecommunications Industries
standard by Association Connecting Electronics Industries, 09/01/2008