Monotonic Bend Characterization of Board-Level Interconnects with Amendment 1
standard by Association Connecting Electronics Industries, 05/01/2015

Mechanical Shock Test Guidelines for Solder Joint Reliability
standard by Association Connecting Electronics Industries, 03/01/2009

Printed Wiring Board Strain Gage Test Guideline
standard by Association Connecting Electronics Industries, 06/01/2005

Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection
standard by Association Connecting Electronics Industries, 12/01/2013

Spherical Bend Test Method for Characterization of Board Level Interconnects
standard by Association Connecting Electronics Industries, 09/01/2011

Test Methods for Characterization of Printed Board Assembly Pad Cratering
standard by Association Connecting Electronics Industries, 12/01/2010

Test Guidelines for Acoustic Emission Measurement during Mechanical Testing
standard by Association Connecting Electronics Industries, 11/01/2013

Surface Mount Placement Equipment Characterization
standard by Association Connecting Electronics Industries, 07/01/2002

Surface Mount Placement Equipment Characterization
standard by Association Connecting Electronics Industries, 11/01/2011