Classification of Non-IC Electronic Components for Assembly Processes
standard by Association Connecting Electronics Industries,

CLSI, HEI, ICC, IPC, NACE, NBBI, TAPPI
IPC
Classification of Non-IC Electronic Components for Assembly Processes
standard by Association Connecting Electronics Industries,
Solderability Tests for Printed Boards
standard by Association Connecting Electronics Industries, 10/01/2022
Guidelines for Microsection Preparation
standard by Association Connecting Electronics Industries, 12/01/2016
Standard for the Management and Mitigation of Cybersecurity Incidents in the Manufacturing Industry Supply Chain
standard by Association Connecting Electronics Industries, 11/01/2022
Reflow Oven Process Control Standard
standard by Association Connecting Electronics Industries, 08/01/2022
Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance Using the IPC-B-52 Test Assembly
standard by Association Connecting Electronics Industries, 10/01/2022
Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
standard by Association Connecting Electronics Industries, 10/01/2022
Requirements and Acceptance for Cable and Wire Harness Assemblies
standard by Association Connecting Electronics Industries, 10/01/2022
Amendment 1 to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards
Amendment by Association Connecting Electronics Industries, 03/01/2022