1.1 This test method covers a means to test a completed Surface Mounted Device (SMD) joint for bond strength and inter-layer stress compatibility
Product Details
- Published:
- 06/01/2015
- Number of Pages:
- 3
- File Size:
- 1 file , 130 KB
Standards list
CLSI, HEI, ICC, IPC, NACE, NBBI, TAPPI