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This specification covers the requirements for electrodeposition of tin on metals and the properties of the deposit. This process has been used typically to prevent galling or seizing of metal surfaces, to provide a surface for soft soldering, or to improve corrosion resistance, but usage is not limited to such applications (See 8.6).
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- Published:
- 09/26/2013
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- 1 file , 730 KB
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- 2 files , 2.3 MB